Final day at SEMICON Taiwan 2025!

Final day at SEMICON Taiwan 2025!
The spotlight this year is firmly on Advanced Packaging and CPO (Co-Packaged Optics) — the next big leap following AI in semiconductors.
At RVi, we're excited to debut our Micro VCSEL concept prototype, highlighting our latest advancements in wafer-level integration and high-speed optoelectronic packaging.
We're exploring a new generation of CPO solutions that target 12.8Tbps data rates, 100% yield, and ultra-low power consumption — from wafer to module.
Don't miss the chance to see this highlight of the year!
Come visit us at Booth R8120 (4F, Silicon Startups Zone) and let’s talk about the future of photonics.
