RVi Accelerates Silicon Photonics Innovation with Industry Veteran Dr. Benson Lin Joining the CPO Leadership Team

Silicon photonics has emerged as one of the fastest-growing technology frontiers in recent years. To meet the exponential demand for high-speed, high-efficiency data transmission, Co-Packaged Optics (CPO) has become a strategic opportunity for Taiwan—also known as "Silicon Island."

To accelerate the formation of a robust silicon photonics ecosystem, NVIDIA and U.S. unicorn Ayar Labs have both established R&D and manufacturing hubs in Taiwan, expanding their local talent pools. At the same time, Marvell is actively seeking leadership for its Taiwan-based silicon photonics team.

Amid this next-generation industrial shift, RVi is proud to welcome Dr. Benson Lin—a veteran with over three decades of experience in advanced IC packaging and more than 200 patents—to join our CPO team as Vice President of Technology Development.

Dr. Lin previously served at TSMC, where he helped establish its first 8-inch and 12-inch bumping fabs. In 2011, he developed the industry's first Cu pillar flip-chip application processor, followed in 2013 by his proposal of the Embedded Trace Substrate (ETS) architecture for Cu pillar bump on trace packaging. He also delivered the first Die-partition InFO-oS package.

Dr. Lin previously led the Advanced Packaging Division at MediaTek. In 2015, his project "MediaTek Interposer Package (MIP), the most cost-effective and performance flip chip package" won the company's R&D Gold Award and entered mass production in 2018, becoming an industry standard.

He also held the role of CSO/SDE Package Lead at Google, where he contributed to high-performance packaging development for next-generation systems.

With Dr. Lin on board, RVi's innovation capabilities are set to reach new heights. Backed by Taiwan's world-class semiconductor infrastructure, we will leverage our AI-powered Micro Emitter mass transfer and smart manufacturing platform to bring greater precision, scalability, and efficiency to silicon photonic light source modules.