RVi Showcases XmartLink™ Optical Engine at OFC 2026, Targeting High-Bandwidth and Low-Power Challenges in AI Data Centers

TAIPEI / LOS ANGELES, March 17, 2026 — Rayleigh Vision Intelligence Co. Ltd. (hereinafter RVi), a Taiwan-based company specializing in optical engine and advanced packaging technology development, today showcased its complete co-packaged optics (CPO) and near-packaged optics (NPO) optical interconnect product line—engineered for the high-bandwidth and energy-efficiency demands of AI data centers—at OFC 2026 (Booth #5055, Los Angeles Convention Center, March 17–19). The exhibits span epitaxial wafers (VCSEL and PD), Micro VCSEL advanced packaging, and the system-level XmartLink™ CPO/NPO optical engine module. 

Industry Context 

OFC officials noted that AI-driven growth is accelerating the industry’s demand for higher bandwidth and better power efficiency, with CPO and NPO architectures ranking among the core topics on this year’s exhibition floor. RVi believes that the practical deployment of CPO requires not only breakthroughs in light sources and packaging, but also vertical integration from epitaxy to module—precisely the technological approach RVi presents at this exhibition. 

RVi CEO JR HAU HE stated: “Addressing the thermal management and maintenance pain points driven by the surge in AI computing power, the products RVi showcases at this exhibition are specifically designed to tackle the high-bandwidth and low-power challenges facing AI data centers. We offer a complete vertically integrated capability from VCSEL/PD epitaxial wafers and CoC-series Micro VCSEL packaging to hot-swappable optical engines supporting ultra-high aggregate bandwidth—helping cloud service providers (CSPs), AI data center operators, server manufacturers, and networking equipment vendors overcome these critical bottlenecks.” 

XmartLink™ CPO/NPO Optical Engine Module 

XmartLink™ is a CPO/NPO optical engine module developed by RVi. It integrates high-speed electrical ICs (EICs) and Micro VCSEL light sources into a high-density package, employing a massive parallel light source architecture to support the bandwidth demands of future AI data centers. The module supports both CPO (Co-Packaged Optics, where the optical engine is co-packaged with the switching ASIC) and NPO (Near-Package Optics, where the optical engine is installed near the switch) deployment architectures, and features a hot-swappable design enabling module replacement in minimal time without interrupting system operation. 

CoC-Series Advanced Packaging: Micro VCSEL Packaging Technology 

Optical engine performance is highly dependent on the packaging quality of the underlying light source. To address this, RVi has developed a Micro VCSEL packaging platform built around CoC (Chip-on-Carrier) technology, offering two packaging architectures: 

Flexible CoC Platform: Provides exceptional design freedom in die arrangement, enabling precise matching to multi-core fiber (MCF) core layouts or specific waveguide input distributions according to customer requirements, thereby simplifying external optical design and improving coupling efficiency. 

Advanced 3D Packaging: Achieves ultra-thin, high-density die packaging that effectively reduces thermal resistance and package height, enabling optical components to be tightly integrated with driver ICs within a heterogeneous packaging architecture—ideal for space-constrained and thermally demanding optical interconnect scenarios. 

Exhibition Information