Micro LED / Mini LED Smart Mixed-Bin Solution
The Micro LED / Mini LED Smart Mixed-Bin Solution is a production solution purpose-built for next-generation display technology manufacturers. It enables customers to overcome process yield bottlenecks, improve production efficiency, and achieve high-throughput, cost-effective mass production.
RVi delivers more than a toolset—we provide a production strategy that redefines manufacturing economics.
Two Core Pillars of the RVi Solution
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Embrace Variations in Incoming Materials, Drastically Reducing Material Costs
Breaking incoming material constraints to unlock profit margins Traditional Micro LED processes impose stringent uniformity requirements on incoming wafer-level dies. Maintaining product yield typically requires transferring dies with exceptionally high photoelectric uniformity. This conventional approach drastically inflates the manufacturing cost per wafer and generates a massive amount of "unusable rejects," severely eroding profitability.
RVi’s smart mixed-bin algorithm liberates customers from the constraints of incoming material quality, allowing them to precisely assemble the optimal visual sequence even when the incoming dies are highly non-uniform. This disruptive innovation fundamentally eliminates dependency on incoming uniformity, slashes process-related costs, and significantly boosts market competitiveness.

Solution |
Wafer Size |
Pass rate/ Wafer Lot |
Pass rate inside wafer |
Systematic Pass rate |
|---|---|---|---|---|
Strict Selection |
6” |
80% |
67% |
53.6% |
RVi AI Mixing |
6”/4” |
100% |
85% |
85.0% |


2. Mass Transfer Yield Loss Below 3 ppm, Shortening Production Cycles
Precision transfer—say goodbye to tedious repair processes By combining RVi's proprietary smart mixed-bin technology with our custom-developed transfer equipment, the yield rate in the critical mass transfer process can exceed 99.9997% (with a loss of fewer than 3 dies per million, or < 3 ppm). This allows customers to dramatically minimize subsequent defect elimination and die-replanting cycles, effectively shortening the overall manufacturing cycle and accelerating time-to-market.

Evaluation Item / Metric |
Transfer Mechanism & Yield |
Repair |
Mixing Technology |
Chip usage (6") |
|---|---|---|---|---|
Conventional Transfer |
Fly transfer, keeps the yield from CoC1, ~99% |
~1% |
Interlaced mixing: inconsistencies in color and brightness |
60~70% |
RVi Mass Transfer |
Enhance yield through selection, ~99.9% |
~0.1% |
AI mixing: High color and brightness consistency |
>85% |
