Solution

Micro LED / Mini LED Smart Mixed-Bin Solution

The Micro LED / Mini LED Smart Mixed-Bin Solution is a production solution purpose-built for next-generation display technology manufacturers. It enables customers to overcome process yield bottlenecks, improve production efficiency, and achieve high-throughput, cost-effective mass production.

 

RVi delivers more than a toolset—we provide a production strategy that redefines manufacturing economics.

 

Two Core Pillars of the RVi Solution

 

  1. Embrace Variations in Incoming Materials, Drastically Reducing Material Costs

Breaking incoming material constraints to unlock profit margins Traditional Micro LED processes impose stringent uniformity requirements on incoming wafer-level dies. Maintaining product yield typically requires transferring dies with exceptionally high photoelectric uniformity. This conventional approach drastically inflates the manufacturing cost per wafer and generates a massive amount of "unusable rejects," severely eroding profitability.

RVi’s smart mixed-bin algorithm liberates customers from the constraints of incoming material quality, allowing them to precisely assemble the optimal visual sequence even when the incoming dies are highly non-uniform. This disruptive innovation fundamentally eliminates dependency on incoming uniformity, slashes process-related costs, and significantly boosts market competitiveness.

 

 

Solution​
Wafer Size​
Pass rate/ Wafer Lot​
Pass rate inside wafer​
Systematic Pass rate​
Strict Selection​

6”

80%

67%

53.6%

RVi AI Mixing​

6”/4”

100%

85%

85.0%

 


2. Mass Transfer Yield Loss Below 3 ppm, Shortening Production Cycles

Precision transfer—say goodbye to tedious repair processes By combining RVi's proprietary smart mixed-bin technology with our custom-developed transfer equipment, the yield rate in the critical mass transfer process can exceed 99.9997% (with a loss of fewer than 3 dies per million, or < 3 ppm). This allows customers to dramatically minimize subsequent defect elimination and die-replanting cycles, effectively shortening the overall manufacturing cycle and accelerating time-to-market.

 

Evaluation Item / Metric
Transfer Mechanism & Yield
Repair
Mixing Technology
Chip usage (6")
Conventional Transfer

Fly transfer, keeps the yield from CoC1, ~99%​

~1%​

Interlaced mixing: inconsistencies in color and brightness​

60~70%

RVi Mass Transfer​

Enhance yield through selection, ~99.9%​

~0.1%​

AI mixing: High color and brightness consistency​

>85%

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